| TECHNOLOGY CAPABILITIES | ||||
| Layer Count[MAX]： | 18 L | |||
| Min. Line Width/Space： | 0.076/0.076mm | |||
| Min.Drilled Hole Size-Mechanical： | 0.2mm | |||
| Min.Drilled Hole Size-Laser： | 0.1mm | |||
| Max. Copper Thickness： | 6 OZ | |||
| Layer To Layer Registration Tolerance ： | ±0.076mm | |||
| Max.Finished Board Thickness ： | 5.0mm | |||
| Min.Finished Board Thickness ： | 0.4mm | |||
| Min.Core Dielectric Thickness ： | 0.076mm | |||
| Max. Drill Aspect Ratio ： | 10:01 | |||
| Press Fit Hole Tolerance ： | ±0.05mm | |||
| Min.Impedance Tolerance ： | ±10% | |||
| HDI Stack Up ： | 1+N+1 | |||
| Controlled Depth Drilling Tolerance ： | ±0.15mm | |||
| Max Production Panel Size ： | 24.5"*32" | |||
| Via In PAD ： | YES | |||
| BGA Pitch(with trace) ： | 0.5mm | |||
| Soldermask Registration ： | ±0.038mm | |||
| Min.Solder Dam ： | 0.064mm | |||
Tel : 86-0755-23491080 27536484
Fax : 86-0755-23193000
Contact : 18948786788 Mr.Yu
E-mail : [email protected]
8th Floor, Block B, Building 6, Zhonggang Plaza, Convention Bay, Fuyong International Convention and Exhibition Center, Bao'an District, Shenzhen
Web : 2233aqek.cn
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